A3P600L-1FG256I

Field Programmable Gate Array Overview

The A3P600L-1FG256I is a low-power field programmable gate array from the ProASIC3L family, manufactured by Microsemi. It features 13824 configurable logic blocks and approximately 600,000 system gates within a 256-pin fine-pitch ball grid array package measuring 17 x 17 mm with a 1 mm pitch. The device supports a maximum operating frequency of 250 MHz and operates across an industrial temperature range of -40°C to +85°C. Key specifications include 1.5V core voltage operation, up to 144 kbits of embedded true dual-port SRAM, and support for mixed-voltage I/O standards including LVDS and DDR.

Field Programmable Gate Array Feature Summary

• Flash-based nonvolatile technology enabling live-at-power-up functionality without external configuration memory
• Low-power architecture utilizing 130nm CMOS process with segmented hierarchical routing
• Advanced I/O subsystem supporting mixed-voltage banks and high-speed differential signaling

Field Programmable Gate Array Applications

• Industrial automation control systems requiring deterministic boot times
• Telecommunications infrastructure equipment needing high-density logic
• Military and aerospace avionics applications demanding radiation tolerance and reliability

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range (-40°C to +85°C) against commercial variants. Confirm RoHS compliance status as legacy ProASIC3L documentation may vary by manufacturing date code. Ensure the 256-FBGA package dimensions match the target PCB footprint requirements before finalizing procurement orders.

Field Programmable Gate Array Selection Notes

Select this component when nonvolatile flash technology is required to eliminate external configuration EEPROMs. Compare capacity against the standard A3P600 if higher performance speeds are needed, or the A3P250 if lower power consumption is the primary constraint. Verify that the 250 MHz speed grade satisfies the timing closure requirements of the target design.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3L family, which bridges the gap between ASICs and traditional SRAM-based FPGAs. It shares architectural similarities with the ProASIC3 family but focuses on reduced power consumption. The 256-ball FBGA package is common across multiple density levels in the series, facilitating pin-compatible design upgrades.

Field Programmable Gate Array Replacement Considerations

The A3P600-1FG256I serves as a higher-performance alternative within the same package. For direct functional replacement, verify compatibility with the A3P600-VFSG256 variant. No direct drop-in replacements exist outside the Microchip portfolio due to proprietary flash architecture.