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A3P600L-1FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P600L-1FGG256 is a field-programmable gate array belonging to the ProASIC3 Flash family, manufactured by Microsemi. It features 13,824 configurable logic blocks and approximately 600,000 system gates. The device supports a maximum operating frequency of 350 MHz and utilizes a 256-pin FineLine BGA package with dimensions of 17 mm x 17 mm and a 1.0 mm pitch. It operates within an industrial temperature range of -40°C to +100°C and includes up to 144 kbits of true dual-port SRAM.
Verify the specific suffix 'L' against official Microsemi documentation to confirm if it denotes a lead-free or low-power variant, as standard datasheets may not explicitly detail this distinction. Ensure the component matches the required RoHS compliance status for your assembly process. Confirm the package type corresponds to the FineLine BGA specification.
Select this model when nonvolatile storage and immediate functionality at power-on are critical requirements. The 256-pin FBGA package offers a balance between high I/O count and board space efficiency. Consider the 350 MHz performance limit relative to your timing constraints before finalizing the design.
This component is part of the ProASIC3 Flash family, which bridges the gap between ASICs and traditional SRAM-based FPGAs. It shares pin compatibility with other devices in the series, such as the A3P250 and A3P1000, facilitating scalable design transitions across different capacity tiers within the same package footprint.
The A3P600-1FGG256 serves as a direct functional substitute within the same family. For upgraded performance, the M1A3P600 series provides integrated ARM Cortex-M1 cores while maintaining pin compatibility.
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