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A3P600L-FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P600L-FGG256 is a field-programmable gate array belonging to the ProASIC3 Flash family. It features 13,824 configurable logic blocks and approximately 600,000 system gates. The device supports maximum clock frequencies up to 350 MHz and utilizes a 256-ball fine-pitch ball grid array package with dimensions of 17 x 17 mm. It operates within an industrial temperature range of -40°C to +100°C and complies with RoHS standards.
Verify the specific suffix 'L' against official Microchip documentation to confirm it denotes low-power characteristics or a specific variant revision. Ensure the component matches the exact pinout and electrical specifications required for your design, as minor suffix variations can affect thermal or power parameters.
Select this component for designs needing high-density logic in a compact BGA footprint with non-volatile storage capabilities. Compare against the standard A3P600 series if lower power consumption is critical, and verify that the 256-pin package fits the board space constraints.
This part belongs to the Microsemi ProASIC3 Flash FPGA family, which bridges the gap between ASICs and traditional SRAM-based FPGAs by offering instant-on functionality. The family provides high performance with reduced system complexity by eliminating external configuration devices.
Direct replacements include the A3P600-FFG256 or A3P600-FGG256, though these may differ in operating temperature ranges or RoHS compliance status. Verify pin compatibility and electrical characteristics before substitution.
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