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A3P600L-FGG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P600L-FGG256I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 13,824 configurable logic blocks and approximately 600,000 system gates. The device operates with a maximum clock frequency of 350 MHz and supports up to 177 user I/Os. It utilizes a 1.2 V core voltage, ranging from 1.14 V to 1.26 V. The component is housed in a 256-pin FineLine BGA package measuring 17 x 17 mm with a 1.0 mm pitch. It functions within an industrial temperature range of -40°C to +85°C.
Verify the specific suffix 'FGG256I' against official Microchip documentation to confirm pinout compatibility and RoHS status. Confirm current availability as legacy components may have limited stock or discontinuation notices. Ensure design-in reviews account for the specific thermal characteristics of the FineLine BGA package during assembly.
Select this model when non-volatile configuration is required to eliminate external PROMs. Compare gate density and I/O count against the A3PE600 series if higher performance is needed. Verify that the 1.2V core voltage aligns with the target system's power delivery network constraints.
This part belongs to the ProASIC3 Flash family, which bridges the gap between ASICs and SRAM-based FPGAs. Unlike volatile counterparts, it retains programming data without power. The 'L' variant typically denotes low-power optimization within the standard A3P600 line.
Direct pin-compatible replacements include the A3P600-1FGG256I. For upgraded performance, consider the A3PE600-1FGG256I, though software migration may be necessary.
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