Field Programmable Gate Array A3PE1500-2FGG676I product image

A3PE1500-2FGG676I

$276.79
  • Description:IC FPGA 444 I/O 676FBGA
  • Series:ProASIC3E

SKU:1e99d0b13023 Category: Brand:

  
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A3PE1500-2FGG676I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 444 I/O 676FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE1500-2FGG676I

  • Description:IC FPGA 444 I/O 676FBGA
  • Series:ProASIC3E
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:276480
  • Number of I/O:444
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)
  • Number of Gates:1500000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3PE1500-2FGG676I

A3PE1500-2FGG676I

Field Programmable Gate Array Overview

The A3PE1500-2FGG676I is a ProASIC3E field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 1,500,000 system gates and 444 I/O pins within a 676-BGA package. The device includes 276,480 bits of embedded RAM and operates on a supply voltage ranging from 1.425V to 1.575V. It supports an industrial temperature range of -40°C to +100°C TJ.

Field Programmable Gate Array Feature Summary

  • ProASIC3E non-volatile flash FPGA architecture
  • High-density logic with 1.5 million system gates
  • Integrated embedded memory for data storage
  • Industrial temperature operation capability

Field Programmable Gate Array Applications

  • Industrial automation control systems
  • Telecommunications infrastructure equipment
  • Military and aerospace avionics subsystems

Field Programmable Gate Array Procurement Notes

Verify the specific suffix '2' indicates the correct speed grade and '-I' confirms the industrial temperature rating against project requirements. Confirm the 676-FBGA footprint matches the PCB design. Check current datasheet revisions for any pinout or electrical characteristic updates prior to final procurement.

Field Programmable Gate Array Selection Notes

Select this component when high-density programmable logic is required in a non-volatile flash FPGA form factor. Ensure the design accommodates the 676-ball BGA package size and thermal dissipation needs. Verify that the 1.5V core voltage and mixed-voltage I/O banks align with the system power architecture.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3E family, which bridges the gap between ASIC performance and FPGA flexibility using flash technology. It serves as a high-performance alternative to traditional SRAM-based FPGAs, offering instant-on functionality without external configuration memory.

Field Programmable Gate Array Replacement Considerations

Direct substitutes include other ProASIC3E variants such as M1A3PE1500-2FGG676I, though the latter integrates an ARM Cortex-M1 processor core. Verify if the additional processing core is compatible with the existing firmware and hardware design constraints.

A3PE1500-2FGG676IA3PE1500-2FGG676I
$276.79
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