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A3PE1500-2PQ208I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 147 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A3PE1500-2PQ208I is a ProASIC3E Field Programmable Gate Array manufactured by Microchip Technology. It features 1,500,000 system gates and 16,384 logic elements within a 208-pin PQFP package. The device supports a maximum operating frequency of 310 MHz and includes 504 kbits of True Dual-Port SRAM. It operates on a 1.5 V core voltage with an input/output range of 1.425 V to 1.575 V. The component supports mixed-voltage I/O standards including LVCMOS and LVDS, functions across a temperature range of -40°C to +85°C, and utilizes surface-mount installation.
Verify the specific suffix 'I' confirms industrial temperature rating compliance before integration. Confirm RoHS status as datasheets may indicate non-compliance for older revisions. Check current production status as this model may be subject to discontinuation notices or limited availability from authorized distributors.
Select this component when both high-capacity FPGA fabric and an embedded microprocessor core are required in a single package. Ensure the 208-pin PQFP footprint fits the PCB layout constraints. Verify that the 1.5 V core voltage supply aligns with the system power architecture and that I/O voltages match connected peripheral requirements.
This part belongs to the ProASIC3E family, which bridges the gap between ASICs and standard FPGAs by offering non-volatile flash technology. It succeeds the ProASIC3 line by adding embedded processor cores and increased logic density while maintaining low power consumption characteristics suitable for space-constrained applications.
Direct pin-compatible replacements within the same package are limited due to the specific embedded core configuration. Consider the M1A3PE1500 series for similar functionality but verify pinout compatibility carefully. Alternative solutions may require redesigning the PCB if moving to different package types like FBGA.
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