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A3PE3000-FG484 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 341 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3PE3000-FG484 is a Field Programmable Gate Array belonging to the ProASIC3 family, manufactured by Microchip Technology. It features 75,264 configurable logic blocks and approximately 3,000,000 equivalent system gates. The device utilizes a 484-terminal FineLine BGA package with dimensions of 23 mm x 23 mm and a height of 2.44 mm. It operates within a commercial temperature range of 0 °C to +70 °C and supports a core voltage supply between 1.425 V and 1.575 V.
Verify the specific suffix codes on the component marking against official Microchip documentation to confirm exact speed grade and temperature rating. Ensure compatibility with existing PCB footprints and verify that the 484-pin FBGA package matches the design constraints. Confirm RoHS compliance status through current datasheets as manufacturing processes may evolve over time.
Compare the A3PE3000 against other ProASIC3 variants based on required gate count and I/O availability. Evaluate power consumption requirements against the standard ProASIC3 specifications versus the low-power ProASIC3L series. Consider thermal management solutions suitable for the BGA package in the intended operating environment.
This component is part of the broader ProASIC3 FPGA portfolio, which bridges the gap between ASICs and SRAM-based FPGAs. The family offers radiation tolerance options and varying density levels. The FG484 designation indicates the specific fine-pitch ball grid array package used for high pin-count implementations within this product line.
Direct pin-compatible replacements include the M1A3PE3000-FFG484I and A3PE3000L-1FG484I. Verify electrical characteristics and timing parameters before substitution. Consult Microchip change notices for any obsolescence updates or recommended alternative part numbers.
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