Field Programmable Gate Array A3PE3000-FGG324 product image

A3PE3000-FGG324

$391.93
  • Description:IC FPGA 221 I/O 324FBGA
  • Series:ProASIC3E

SKU:c9b0de29eab0 Category: Brand:

  
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A3PE3000-FGG324 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 221 I/O 324FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE3000-FGG324

  • Description:IC FPGA 221 I/O 324FBGA
  • Series:ProASIC3E
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:516096
  • Number of I/O:221
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:324-BGA
  • Supplier Device Package:324-FBGA (19x19)
  • Number of Gates:3000000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3PE3000-FGG324

A3PE3000-FGG324

Field Programmable Gate Array Overview

The M1A3PE3000-FGG324 is a ProASIC3 FPGA from Microchip Technology featuring an integrated ARM Cortex-M1 processor and 35,000 logic elements. It utilizes flash-based non-volatile technology for instant-on operation without external configuration memory. The device operates within a core voltage range of 1.425 V to 1.575 V and supports industrial temperature ranges down to -40°C. It is housed in a 324-ball FineLine BGA package with a 0.8 mm pitch, providing high-density I/O capabilities suitable for complex embedded control applications.

Field Programmable Gate Array Feature Summary

  • Integrates an ARM Cortex-M1 processor alongside programmable logic for mixed-signal system solutions
  • Utilizes flash-based architecture enabling instant power-up functionality without external boot devices
  • Supports mixed-voltage I/O standards including LVDS and LVTTL for flexible interface connectivity

Field Programmable Gate Array Applications

  • Industrial automation controllers requiring deterministic real-time processing
  • Telecommunications infrastructure equipment needing low-latency signal handling
  • Medical imaging systems demanding high reliability and instant operational readiness

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official Microchip documentation to ensure correct package type and temperature grade. Confirm RoHS compliance status and moisture sensitivity level requirements prior to ordering. Check for any export restrictions or additional documentation needed for procurement depending on the destination region.

Field Programmable Gate Array Selection Notes

Select this component when a combination of general-purpose programmable logic and a dedicated microcontroller is required in a single die. Ensure the design accommodates the 324-ball FBGA footprint and thermal dissipation requirements. Verify that the 35K LE capacity meets the logic density needs compared to smaller ProASIC3 variants.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3 family, which bridges the gap between traditional ASICs and SRAM-based FPGAs by offering non-volatile reprogrammability. The inclusion of the ARM Cortex-M1 distinguishes it from standard logic-only FPGAs, allowing for hardware-software co-design within a single chip architecture.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements may include other ProASIC3 models with similar I/O counts but different logic densities. Verify if the M1A3PE3000 series variants with different package options serve as functional substitutes for layout modifications.

A3PE3000-FGG324A3PE3000-FGG324
$391.93
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