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A3PE3000-FGG896 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 620 I/O 896FBGA. Review the specifications below when checking this part for your BOM.
The A3PE3000-FGG896 is a ProASIC3E Flash FPGA manufactured by Microchip Technology. It features 3 million system gates and 75,264 configurable logic blocks (CLBs). The device supports up to 620 user I/Os and operates with a core voltage range of 1.425 V to 1.575 V. It achieves a maximum system performance frequency of 350 MHz. The component is housed in an FBGA-896 package suitable for surface mount technology. It functions within an operating temperature range of 0°C to +70°C.
Verify the specific suffix FGG896 against official Microchip documentation to confirm pinout compatibility and package dimensions. Ensure environmental compliance requirements match project specifications. Confirm availability status directly with authorized distributors as supply chain conditions vary. Validate that the lead time aligns with production schedules before finalizing orders.
Select this model when high gate density and non-volatile configuration are required without external boot devices. Compare power consumption metrics against competing SRAM-based FPGAs for efficiency analysis. Evaluate the 350 MHz speed grade against timing constraints of the target design architecture. Consider the FBGA-896 footprint for PCB layout feasibility and thermal management requirements.
This component belongs to the ProASIC3E family, which bridges the gap between ASICs and traditional FPGAs by offering flash-based reprogrammability. It provides designers with the flexibility of field programmability combined with the instant-on reliability typically associated with mask-programmed chips. The series is designed for cost-sensitive, high-volume applications needing robust performance.
Direct replacements include other variants within the A3PE3000 series such as A3PE3000-1FGG896 or M1A3PE3000-FG896, provided pinouts and electrical characteristics are verified. Cross-family migration to PolarFire or IGloo2 may require significant design adaptation due to architectural differences.
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