Field Programmable Gate Array A3PE3000-FGG896I product image

A3PE3000-FGG896I

$494.42
  • Description:IC FPGA 620 I/O 896FBGA
  • Series:ProASIC3E

SKU:f32d6c7597c5 Category: Brand:

  
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A3PE3000-FGG896I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 620 I/O 896FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE3000-FGG896I

  • Description:IC FPGA 620 I/O 896FBGA
  • Series:ProASIC3E
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:516096
  • Number of I/O:620
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:896-BGA
  • Supplier Device Package:896-FBGA (31x31)
  • Number of Gates:3000000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3PE3000-FGG896I

A3PE3000-FGG896I

Field Programmable Gate Array Overview

The A3PE3000-FGG896I is a ProASIC3E Flash FPGA manufactured by Microchip Technology. It features 3,000,000 system gates and 35,000 logic elements within an FBGA-896 package. The device supports up to 620 user I/Os and operates with a core voltage range of 1.425 V to 1.575 V. It includes 504 kbits of True Dual-Port SRAM for embedded memory applications. The component is rated for industrial temperatures from -40°C to +85°C and achieves maximum system performance frequencies up to 350 MHz.

Field Programmable Gate Array Feature Summary

  • Flash-based non-volatile architecture enabling live at power-up functionality without external configuration memory
  • Integrated high-capacity dual-port SRAM supporting complex data buffering and processing tasks
  • Supports in-system programming and secure design protection via on-chip AES decryption

Field Programmable Gate Array Applications

  • Industrial automation control systems requiring deterministic boot times
  • Telecommunications infrastructure equipment utilizing PCI interfaces
  • Test and measurement instrumentation requiring reprogrammable logic cores

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'FGG896' confirms the FBGA-896 package and industrial temperature grade. Confirm RoHS compliance status through official datasheets as manufacturing processes evolve. Check for End-of-Life notifications or Product Change Notices regarding supply continuity. Ensure compatibility with existing PCB footprints and thermal management requirements for the 896-ball BGA format.

Field Programmable Gate Array Selection Notes

Select this model when high gate density and large I/O counts are required in a compact footprint. Compare against the M1A3PE3000 series if integrated ARM Cortex-M1 processor support is necessary instead of pure logic resources. Evaluate power consumption profiles against the 1.5V core voltage specifications for battery-operated or thermally constrained environments.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3E family, representing a mid-to-high density flash FPGA solution. It bridges the gap between lower-density ProASIC3 parts and higher-end RTAX serial FPGAs. The part utilizes a 130-nm process technology, offering a balance of performance, power efficiency, and non-volatile reliability for general-purpose programmable logic applications.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements may be limited due to package specificity. Consider the A3PE3000-FFGG896I for equivalent logical capacity and package form factor. Verify functional equivalence regarding I/O standards and memory configurations before substituting.

A3PE3000-FGG896IA3PE3000-FGG896I
$494.42
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