A3PE3000L-1FG484

Field Programmable Gate Array Overview

The A3PE3000L-1FG484 is a ProASIC3 Low Power Flash FPGA manufactured by Microchip Technology. It features 35,000 logic elements and 3,000,000 system gates within an FBGA-484 package. The device supports a maximum operating frequency of 892.86 MHz and provides 341 I/O pins. It operates with a core voltage range of 1.14 V to 1.26 V and an I/O voltage of 1.5 V. The commercial temperature grade covers 0°C to +70°C. The component utilizes non-volatile flash technology for instant-on configuration without external memory.

Field Programmable Gate Array Feature Summary

• Integrates ARM Cortex-M1 processor for embedded control capabilities alongside programmable logic
• Utilizes flash-based non-volatile architecture enabling instantaneous power-up operation
• Supports low-power consumption through Flash*Freeze mode for immediate entry and exit from sleep states
• Offers flexible I/O standards including LVCMOS, LVTTL, LVDS, and differential signaling options

Field Programmable Gate Array Applications

• Industrial automation controllers requiring deterministic real-time processing
• Telecommunications infrastructure equipment needing high-speed serial interfaces
• Medical imaging systems demanding reliable non-volatile configuration storage
• Automotive electronics applications with strict environmental stability requirements

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official Microchip documentation to confirm temperature grade and package variations. Ensure compatibility with existing PCB footprints for the FBGA-484 form factor. Check for moisture sensitivity level handling requirements during assembly. Confirm end-of-life status or obsolescence notices prior to final design approval. Validate supply chain authenticity through authorized distribution channels only.

Field Programmable Gate Array Selection Notes

Compare logic density and I/O count against alternative ProASIC3 family members to ensure optimal resource utilization. Evaluate power consumption profiles under different clock frequencies and load conditions. Assess thermal management needs based on the specified operating temperature range. Consider pin compatibility with other devices in the same package family for design flexibility. Review programming tool support and software development kit availability for the integrated processor core.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3 Low Power family, designed for cost-sensitive applications requiring moderate logic capacity. It bridges the gap between standard ASICs and SRAM-based FPGAs by offering reprogrammability with flash persistence. The series emphasizes low static and dynamic power consumption suitable for battery-operated or thermally constrained environments.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible substitutes within the ProASIC3L family include variants with different speed grades or temperature ranges. Cross-family migration to PolarFire or IGLOO2 may offer improved performance but requires schematic and layout redesign. Verify functional equivalence of the embedded processor interface when considering architectural alternatives.