Field Programmable Gate Array A3PE3000L-1FGG324I product image

A3PE3000L-1FGG324I

  • Description:IC FPGA 221 I/O 324FBGA
  • Series:ProASIC3L

SKU:f6c0de0754cf Category: Brand:

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A3PE3000L-1FGG324I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 221 I/O 324FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE3000L-1FGG324I

  • Description:IC FPGA 221 I/O 324FBGA
  • Series:ProASIC3L
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Total RAM Bits:516096
  • Number of I/O:221
  • Voltage - Supply:1.14V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:324-BGA
  • Supplier Device Package:324-FBGA (19x19)
  • Number of Gates:3000000

Field Programmable Gate Array datasheet and documents for A3PE3000L-1FGG324I

A3PE3000L-1FGG324I

Field Programmable Gate Array Overview

The A3PE3000L-1FGG324I is a low-power flash-based Field Programmable Gate Array (FPGA) from the ProASIC3L family, manufactured by Microchip Technology. It features 35,000 logic elements and supports up to 296 I/Os within an FBGA-324 package. The device operates with core and I/O voltages ranging from 1.14 V to 1.26 V and functions reliably across an industrial temperature range of -40°C to +85°C. It integrates distributed RAM for data storage and supports high-speed serial communication standards including LVDS and SSTL.

Field Programmable Gate Array Feature Summary

  • Flash-based non-volatile architecture enabling instant power-up configuration without external memory.
  • Supports mixed-voltage I/O banks allowing compatibility with various logic families.
  • Includes Flash*Freeze technology for instantaneous entry into ultra-low power standby modes.

Field Programmable Gate Array Applications

  • Industrial automation control systems requiring deterministic boot times.
  • Telecommunications infrastructure utilizing high-speed differential signaling.
  • Test and measurement equipment needing reconfigurable logic interfaces.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the package type matches the required PCB footprint for FBGA-324 components. Ensure design tools support the ProASIC3L library for accurate synthesis and place-and-route operations.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile configuration and low static power are critical requirements. Compare against SRAM-based FPGAs if immediate boot capability is necessary. Evaluate pin count availability as the 324-ball package limits maximum I/O density compared to larger packages in the same series.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3L Low Power Flash FPGA series, which succeeded earlier Actel designs after Microchip's acquisition. It serves as a bridge between traditional ASICs and SRAM FPGAs, offering the flexibility of programmability with the persistence of flash memory technology.

Field Programmable Gate Array Replacement Considerations

Direct replacements include other variants within the A3PE3000L series such as A3PE3000L-1FGG324 or A3PE3000L-1PQG208I, provided pinout and I/O counts align with the existing design constraints.

A3PE3000L-1FGG324IA3PE3000L-1FGG324I

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