A3PE3000L-FG896M

Field Programmable Gate Array Overview

The A3PE3000L-FG896M is a ProASIC3 Low Power Flash FPGA manufactured by Microchip Technology. It features 35,000 logic elements and approximately 3 million system gates within a 27x27 mm FBGA package containing 896 terminals. The device supports core and I/O voltages ranging from 1.14 V to 1.575 V. It includes up to 504 kbits of distributed RAM and operates at maximum frequencies up to 350 MHz. The component functions within an industrial temperature range of -40 °C to +85 °C.

Field Programmable Gate Array Feature Summary

• Non-volatile flash-based architecture enabling live-at-power-up operation without external configuration memory
• Integrated low-power mode allowing instantaneous entry and exit to reduce dynamic and static power consumption
• Support for diverse single-ended, differential, and voltage-referenced I/O standards with programmable slew rates

Field Programmable Gate Array Applications

• Industrial control systems requiring non-volatile configuration and high reliability
• Telecommunications infrastructure utilizing high-speed serial interfaces
• Automotive electronics demanding robust performance across wide temperature ranges

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'M' against official Microchip documentation to confirm if it denotes a military-grade variant or specific environmental qualification distinct from standard commercial parts. Ensure compliance with RoHS directives and check for any End-of-Life notifications or production discontinuation notices prior to procurement planning.

Field Programmable Gate Array Selection Notes

Select this component when a high-density FPGA with non-volatile storage and low power consumption is required. Compare the 35k LE capacity and 896-pin package against alternative ProASIC3 family members to ensure pin compatibility and sufficient logic resources for the target design complexity.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3 Low Power Flash FPGA family, which utilizes a 130-nm CMOS process. It is designed to replace SRAM-based FPGAs in applications where instant-on capability and radiation tolerance are critical. The family offers a balance of high logic density and reduced power dissipation compared to previous generation Actel devices.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same package include other variants of the A3PE3000L series. Verify functional equivalence regarding I/O voltage levels and timing characteristics before substituting with similar high-density flash FPGAs from the manufacturer.