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A3PE600-2FG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 165 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3PE600-2FG256I is a ProASIC3 Low Power Field Programmable Gate Array manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks within a 256-pin FineLine BGA package measuring 17x17 mm. The device operates on a core voltage range of 1.14 V to 1.575 V and supports up to 270 user I/Os. It offers an industrial temperature range from -55°C to +125°C and includes up to 144 kbits of True Dual-Port SRAM.
Verify the specific suffix codes against official Microchip documentation to confirm temperature grade and package variations. Ensure compliance with export control classifications such as ECCN 3A991 if applicable. Confirm RoHS status and REACH compliance requirements prior to integration into final assemblies.
Select this component when non-volatile configuration and extended temperature ranges are mandatory. Compare total gate counts and SRAM capacity against standard ProASIC3 models to ensure sufficient logic resources. Verify pin compatibility with existing PCB layouts due to the shared 256-FPBGA footprint across the family.
This part belongs to the ProASIC3 Low Power family, designed for applications demanding reduced power dissipation compared to standard flash FPGAs. It shares architectural similarities with the ProASIC3E series but focuses on efficiency and ruggedness rather than maximum clock speed optimization.
Direct replacements include other variants within the ProASIC3 Low Power family, such as the A3PE250 or A3PE400, provided pinouts and resource requirements align. Standard ProASIC3 parts like the A3P600 offer similar gate counts but lack the specific low-power optimizations and extended temperature ratings.
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