A3PE600-2FGG256

Field Programmable Gate Array Overview

The A3PE600-2FGG256 is a ProASIC3E Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks (CLBs). The device includes up to 144 kbits of true dual-port SRAM and supports up to 300 user I/Os. It operates on a 1.5 V core voltage with mixed-voltage I/O support for 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. The component utilizes a 256-pin FineLine BGA package and offers a maximum system performance frequency of 350 MHz.

Field Programmable Gate Array Feature Summary

• Flash-based CMOS process enabling live at power-up functionality without external configuration memory
• Supports in-system programming and secure ISP using on-chip 128-bit advanced encryption
• Provides mixed-voltage I/O operation compatible with multiple industry-standard signaling protocols

Field Programmable Gate Array Applications

• High-density digital signal processing implementations
• Secure communication interface prototyping
• Industrial control systems requiring non-volatile reprogrammability

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official Microchip documentation to confirm temperature range and package variations. Confirm RoHS compliance status as it varies by manufacturing site. Ensure ESD handling procedures are followed during assembly due to the fine-pitch BGA packaging requirements.

Field Programmable Gate Array Selection Notes

Select this model when a mid-range FPGA capacity with integrated flash technology is required. Compare against the standard A3P600 series if lower cost is prioritized over low-power consumption. Verify that the 256-pin FBGA footprint matches the target PCB layout constraints before finalizing the design.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3E family, which extends the capabilities of the original ProASIC3 line with enhanced low-power features. The family provides a transition path from ASIC designs while maintaining the flexibility of programmable logic. It is designed for applications needing high density in compact packages.

Field Programmable Gate Array Replacement Considerations

The A3P600-2FGG256 serves as a direct functional predecessor within the same package form factor. Designers migrating from older technologies should verify pin compatibility and timing constraints carefully.