Field Programmable Gate Array A3PE600-FGG256 product image

A3PE600-FGG256

$66.12
  • Description:IC FPGA 165 I/O 256FBGA
  • Series:ProASIC3E

SKU:7f154b0d2852 Category: Brand:

  
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A3PE600-FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 165 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE600-FGG256

  • Description:IC FPGA 165 I/O 256FBGA
  • Series:ProASIC3E
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:110592
  • Number of I/O:165
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:600000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3PE600-FGG256

A3PE600-FGG256

Field Programmable Gate Array Overview

The A3PE600-FGG256 is a ProASIC3E Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks within a 256-pin FineLine BGA package. The device includes up to 144 kbits of True Dual-Port SRAM and supports up to 300 user I/Os. It operates on a 1.5V core voltage with mixed-voltage I/O support for 1.5V, 1.8V, 2.5V, and 3.3V standards. The industrial temperature range extends from -40°C to +100°C TJ, ensuring reliability in demanding environments.

Field Programmable Gate Array Feature Summary

  • Flash-based non-volatile architecture enabling live-at-power-up functionality without external configuration memory.
  • Supports high-speed data transfer with 700 Mbps DDR capabilities and LVDS-capable I/Os.
  • Provides flexible mixed-voltage I/O operation across multiple banks for diverse interface requirements.

Field Programmable Gate Array Applications

  • Industrial automation control systems requiring deterministic real-time processing.
  • Aerospace and defense avionics utilizing radiation-tolerant flash technology.
  • Telecommunications infrastructure equipment needing high-density interconnects.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'FGG256' corresponds to the 256-pin FineLine BGA package variant. Confirm RoHS compliance status as some ProASIC3E variants may differ. Check for export control classifications such as ECCN 3A991D if applicable to your region. Ensure design-in tools are compatible with the ProASIC3E family before procurement.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile flash configuration is required to eliminate external boot ROMs. Compare gate counts against the standard A3P600 series if lower power consumption is not critical. Verify that the 256-pin FBGA footprint fits the target PCB layout constraints. Consider the M1A3P600 series if embedded ARM Cortex-M1 processing is needed instead of pure logic capacity.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3E Flash FPGA family, which serves as an evolution of the original ProASIC3 line. It offers enhanced performance and additional embedded memory compared to its predecessors while maintaining pin compatibility with other devices in the broader ProASIC3 ecosystem for scalable design migration.

Field Programmable Gate Array Replacement Considerations

The A3P600-FFG256I is a pin-compatible alternative within the standard ProASIC3 family, though it lacks the specific low-power optimizations of the E-series. Designers should verify thermal characteristics and I/O drive strengths when substituting between these closely related part numbers.

A3PE600-FGG256A3PE600-FGG256
$66.12
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