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A3PE600-FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 165 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3PE600-FGG256 is a ProASIC3E Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks within a 256-pin FineLine BGA package. The device includes up to 144 kbits of True Dual-Port SRAM and supports up to 300 user I/Os. It operates on a 1.5V core voltage with mixed-voltage I/O support for 1.5V, 1.8V, 2.5V, and 3.3V standards. The industrial temperature range extends from -40°C to +100°C TJ, ensuring reliability in demanding environments.
Verify the specific suffix 'FGG256' corresponds to the 256-pin FineLine BGA package variant. Confirm RoHS compliance status as some ProASIC3E variants may differ. Check for export control classifications such as ECCN 3A991D if applicable to your region. Ensure design-in tools are compatible with the ProASIC3E family before procurement.
Select this model when non-volatile flash configuration is required to eliminate external boot ROMs. Compare gate counts against the standard A3P600 series if lower power consumption is not critical. Verify that the 256-pin FBGA footprint fits the target PCB layout constraints. Consider the M1A3P600 series if embedded ARM Cortex-M1 processing is needed instead of pure logic capacity.
This component belongs to the ProASIC3E Flash FPGA family, which serves as an evolution of the original ProASIC3 line. It offers enhanced performance and additional embedded memory compared to its predecessors while maintaining pin compatibility with other devices in the broader ProASIC3 ecosystem for scalable design migration.
The A3P600-FFG256I is a pin-compatible alternative within the standard ProASIC3 family, though it lacks the specific low-power optimizations of the E-series. Designers should verify thermal characteristics and I/O drive strengths when substituting between these closely related part numbers.
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