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The A3PE600L-1FG484M is a low-power Field Programmable Gate Array (FPGA) from the ProASIC3 family, manufactured by Microchip Technology. It features 600,000 equivalent gates and 13,824 logic cells within a 484-pin FineLine BGA package. The device operates on a single 1.5V supply voltage with a range of 1.14V to 1.575V. It supports a maximum operating frequency of 250 MHz and functions across an extended temperature range of -55°C to +125°C. This component integrates non-volatile flash technology for instant-on capability without external configuration memory.
Verify the specific suffix 'M' indicates the military/extended grade variant with the -55°C to +125°C temperature rating. Confirm RoHS compliance status as older Actel/Microchip flash FPGAs may have specific environmental declarations. Check for export control classifications such as ECCN if shipping internationally. Ensure the 484-pin FBGA footprint matches the target PCB design guidelines provided in the datasheet.
Select this model when instant-on boot time is critical and external configuration EEPROMs cannot be used. Compare against the standard A3PE600L for cost differences if the extended temperature range is not required. Consider the A3P600 series if higher performance speeds are needed and non-volatility is less important. Evaluate pin count requirements as the 484-pin package limits available I/O compared to larger packages.
This part belongs to the ProASIC3 Low Power family, which bridges the gap between ASICs and SRAM-based FPGAs. Unlike volatile SRAM FPGAs, it retains configuration data without power. The 'M' suffix typically denotes enhanced reliability or extended temperature specifications compared to commercial variants. It serves as a drop-in replacement for many legacy CPLD or ASIC designs requiring reprogrammability.
Direct substitutes include the A3PE600L-1FG484 for commercial temperature ranges. For higher density needs, consider the A3PE3000 series. Verify pin compatibility before replacing with other ProASIC3 variants, as package dimensions and pin assignments may differ significantly between FBGA sizes.