A3PE600L-1FGG484M

A3PE600L-1FGG484M

  • Description:IC FPGA 270 I/O 484FBGA
  • Series:ProASIC3EL

SKU:c67bc020d041 Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 270 I/O 484FBGA
  • Series:ProASIC3EL
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Total RAM Bits:110592
  • Number of I/O:270
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-55°C ~ 125°C (TJ)
  • Package / Case:484-BGA
  • Supplier Device Package:484-FPBGA (23x23)
  • Number of Gates:600000

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A3PE600L-1FGG484M

Overview

The A3PE600L-1FGG484M is a ProASIC3 Low Power Field Programmable Gate Array manufactured by Microchip Technology. It features 7,000 logic elements and 600,000 system gates within an FBGA-484 package. The device supports up to 270 I/Os and operates on a core voltage ranging from 1.14 V to 1.575 V. It functions reliably across an industrial temperature range of -55°C to +125°C with a maximum operating frequency of 250 MHz.

Feature Summary

  • Integrates low-power anti-fuse technology for non-volatile configuration without external memory requirements.
  • Provides high-density programmable logic with significant gate counts suitable for complex digital designs.
  • Supports extensive input/output capabilities through a compact surface-mount package format.

Applications

  • Industrial control systems requiring robust performance in extreme temperatures
  • Aerospace and defense signal processing applications
  • Telecommunications infrastructure hardware

Procurement Notes

Verify the specific suffix M against official Microchip documentation to confirm package type and temperature grade. Ensure compliance with export regulations if shipping from the United States, as this component may require additional authorization documents for international transport.

Selection Notes

Select this model when a balance of moderate logic density and wide industrial temperature range is required. Compare against the standard A3PE600L variant if lower cost is acceptable for commercial temperature ranges. Confirm that the 484-pin FBGA footprint matches the target PCB layout constraints.

Part Context

This component belongs to the ProASIC3 Low Power family, designed for applications demanding radiation tolerance and security. It serves as a bridge between discrete logic solutions and larger SRAM-based FPGAs, offering immediate power-up functionality due to its non-volatile architecture.

Replacement Considerations

Direct replacements include other variants within the A3PE600L series with different speed grades or package options. Verify pin compatibility before substituting with higher-density models like the A3PE3000L, as logical resources differ significantly.

A3PE600L-1FGG484MA3PE600L-1FGG484M

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