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The A3PN030-Z2QNG68I is a ProASIC3 nano field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 30,000 system gates and 768 configurable logic blocks (CLBs). The device supports up to 71 user I/Os and includes 36 kbits of embedded True Dual-Port SRAM. It operates on a core supply voltage ranging from 1.425V to 1.575V. The component is housed in a 68-VFQFN package with exposed pads, measuring 8x8 mm. It is rated for an industrial operating temperature range of -40°C to +100°C (TJ) and complies with RoHS3 standards.
Verify the specific suffix Z2 against official Microchip documentation to confirm pinout and electrical characteristics, as suffix variations can indicate different speed grades or packaging options. Ensure compatibility with the design tool version used for programming the ProASIC3 nano family. Confirm RoHS3 compliance status for the specific manufacturing batch if required by regulatory standards.
Select this model when a balance of moderate logic density (30k gates) and integrated memory is required in a compact QFN footprint. Compare against the A3PN020 for lower gate counts or the A3PN060 for higher capacity within the same series. Consider the 68-pin limit when mapping I/O requirements, ensuring the 71 available pins meet the interface needs of the target application.
This component belongs to the ProASIC3 nano family, which utilizes a 130nm flash process technology. Unlike SRAM-based FPGAs, this family retains configuration data without power, simplifying board design by eliminating external configuration chips. The A3PN030 variant sits in the mid-range of the nano series, offering enhanced memory resources compared to smaller gate-count devices while maintaining a small form factor suitable for space-constrained designs.
Direct pin-compatible replacements within the ProASIC3 nano family include the A3PN020 (lower capacity) and A3PN060 (higher capacity), provided logic resource requirements are adjusted accordingly. Verify that any substitute part shares the identical 68-VFQNN package dimensions and thermal pad configuration to ensure mechanical fit.