A3PN250-Z1VQ100I

Overview

The A3PN250-Z1VQ100I is a ProASIC3 nano Field Programmable Gate Array (FPGA) manufactured by Microchip Technology. It features 250,000 gates and 36,864 total RAM bits within a 100-VQFP package. The device supports 68 I/O pins and operates at a supply voltage range of 1.425 V to 1.575 V. It is classified as an obsolete product with no current production availability.

Feature Summary

• Non-volatile flash-based FPGA architecture for instant-on functionality
• High-density logic implementation with integrated memory resources
• Industrial temperature range operation capability

Applications

• Secure embedded control systems requiring non-vatile configuration retention
• Industrial automation interfaces
• Telecommunications signal processing modules

Procurement Notes

This component is officially listed as obsolete and discontinued by the manufacturer. No new units are available from authorized distributors or the factory. Procurement must rely on existing surplus stock from third-party suppliers. Verify authenticity and storage history carefully due to potential long-term shelf life issues associated with obsolete inventory.

Selection Notes

Designers should consider this part only for legacy system maintenance or repair scenarios where specific form-factor and pinout compatibility are mandatory. New designs should migrate to current Microchip FPGA families such as PolarFire or SmartFusion2 to ensure long-term supply chain stability and access to updated technical support.

Part Context

The A3PN250-Z1VQ100I belongs to the ProASIC3 nano family, which utilizes flash technology to eliminate the need for external configuration memory. This series was designed for applications demanding low power consumption and high reliability in harsh environments. The Z1 suffix typically denotes specific commercial/industrial grade variations within the broader ProASIC3 portfolio.

Replacement Considerations

No direct public substitute part numbers are confirmed for this obsolete component. Engineers must evaluate functional equivalents from the same manufacturer's newer generations, such as the PolarFire or IGloo2 series, ensuring pin-to-pin compatibility or redesigning the PCB layout to accommodate different package dimensions.