A3PN250-Z1VQG100

Overview

The A3PN250-Z1VQG100 is a ProASIC3 Nano field-programmable gate array manufactured by Microchip Technology. It features 3,000 logic elements and 68 I/Os within a VQFP-100 package. The device operates on a core voltage ranging from 1.425 V to 1.575 V and supports a maximum frequency of 350 MHz. It includes 36 kbit of embedded memory and functions across an industrial temperature range of -40°C to +85°C.

Feature Summary

• Non-volatile flash-based FPGA architecture for instant-on operation without external configuration memory.
• Integrated security features including bitstream encryption and user code authentication.
• Supports in-system programming and reconfiguration capabilities via standard interfaces.

Applications

• Industrial control systems requiring rapid boot-up times.
• Automotive electronics with strict environmental tolerance requirements.
• Communication infrastructure equipment needing secure configuration.

Procurement Notes

Verify the specific suffix Z1 against official Microchip documentation to confirm the exact temperature grade and package variant. Ensure compatibility with existing PCB footprints for the VQFP-100 form factor. Confirm moisture sensitivity level handling procedures during assembly to prevent damage.

Selection Notes

Select this component when non-volatile configuration and low power consumption are critical. Compare logic density and I/O count against similar ProASIC3 models like the A3PN250-VQG100. Evaluate thermal performance within the specified -40°C to +85°C range for the target application environment.

Part Context

This part belongs to the Microchip ProASIC3 Nano family, designed for cost-sensitive and space-constrained applications. It bridges the gap between simple PLDs and complex FPGAs, offering flash-based persistence. The series emphasizes security and ease of use for embedded logic designs.

Replacement Considerations

Direct substitutes include other variants within the A3PN250 series such as A3PN250-VQG100 or A3PN250-2VQG100I, provided pinout and electrical specifications match. Verify that alternative packages maintain the same footprint constraints.