A5EA013BB23BI6S

Overview

The Altera A5EA013BB23BI6S is an Agilex 5E Series System on Chip FPGA featuring a hybrid architecture. It integrates an FPGA fabric with 138K logic elements and a Hard Processor System (HPS) comprising dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 processors equipped with CoreSight. The device operates at speeds up to 1.8GHz, includes 512kB of RAM, and provides 400 I/Os. It is housed in a 795-VPBGA package measuring 23x23 mm, supports peripherals such as DDR, DMA, PCIe, and WDT, and functions within a junction temperature range of -40°C to 100°C.

Feature Summary

• Hybrid SoC architecture combining 138K FPGA logic elements with dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 MPCore processors.
• High-performance processing cores operating at frequencies up to 1.8GHz with integrated CoreSight debugging capabilities.
• Comprehensive connectivity including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, and peripherals like DDR, DMA, and PCIe.
• Compact 795-VPBGA (23x23 mm) packaging with 400 available I/Os for dense system integration.

Applications

• Edge computing devices requiring high performance-per-watt efficiency.
• Industrial automation controllers utilizing the ruggedized temperature range and reliable SoC architecture.
• Embedded sensor systems leveraging scalable FPGA fabric and diverse I/O standards.
• Secure embedded applications benefiting from integrated security features and functional safety support.

Procurement Notes

Verify the specific suffix 'I6S' against official Intel/Altera documentation to confirm exact speed grade, temperature rating, and package variant. Confirm moisture sensitivity level (MSL 3) and handling requirements during assembly. Ensure compatibility with the Agilex 5 FPGA toolchain for both HPS and FPGA configuration. Check for any recent Product Change Notifications regarding label or material updates.

Selection Notes

Select this part when a balance of moderate FPGA density (138K LEs) and powerful application processing is required. Compare against other Agilex 5E variants based on specific I/O count needs and thermal constraints. The 795-VPBGA package suits designs with space limitations but requires adequate PCB routing for the high pin count. Validate that the 512kB internal RAM meets the HPS memory requirements before finalizing the design.

Part Context

This component belongs to the Agilex 5 E-Series, which targets power-efficient edge and embedded applications. It utilizes the second-generation Hyperflex FPGA architecture and offers improved performance-per-watt compared to previous 16nm nodes. The series emphasizes scalability across a wide density range and integrates advanced security features through the Secure Device Manager.

Replacement Considerations

Direct substitutes within the same family include A5EA013BB23AI6S or A5EA013BB23CI6S, differing primarily in speed grades or temperature ranges. For higher density, consider A5EC013BB23BI6S. Verify pinout and electrical specifications carefully when cross-referencing with older Cyclone V devices, as architectural differences exist.