A5EB008BB23BI6X

Overview

The Altera A5EB008BB23BI6X is a System-on-Chip FPGA belonging to the Agilex 5 E-Series. It integrates an FPGA fabric with a hard processor system featuring dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 processors equipped with CoreSight. The device provides 85,000 logic elements and supports operating frequencies of up to 1.5 GHz for the Cortex-A76 cores and 1.8 GHz for the Cortex-A55 cores. It includes 512 kB of embedded RAM and offers 264 general-purpose I/Os. The component is housed in an 839-VPBGA package measuring 23x23 mm and operates within a junction temperature range of 0°C to 100°C.

Feature Summary

• Agilex 5 E-Series architecture with 85K logic elements
• Dual-core ARM Cortex-A76 (1.5GHz) and dual-core ARM Cortex-A55 (1.8GHz) HPS
• Integrated security via Secure Device Manager
• Support for DDR, DMA, PCIe, and Ethernet interfaces

Applications

• Edge AI inference acceleration
• Industrial automation controllers
• Network infrastructure endpoints

Procurement Notes

Verify the specific suffix 'X' against official Intel/Altera documentation to confirm if it denotes a specific tape-and-reel or tray configuration, as standard listings often default to tray packaging. Confirm moisture sensitivity level (MSL 3) handling requirements prior to assembly. Cross-reference the part number with current product change notifications to ensure no label or material updates have occurred since the last datasheet revision.

Selection Notes

Select this model when 85K logic elements are required alongside asymmetric multi-core processing capabilities. Compare against the A5EC008BB23AE6S variant to determine if the commercial temperature range (0°C to 100°C) suffices over industrial ranges. Ensure the 839-VPBGA footprint fits the PCB layout constraints, noting the 23x23 mm dimension and 264 available I/O pins for interface connectivity.

Part Context

This component is part of the Agilex 5 E-Series, designed for power-efficient edge applications. It utilizes the second-generation Hyperflex architecture to deliver improved performance-per-watt compared to previous generation nodes. The series targets scalable deployment across various density points, ranging from 50KLE to higher capacities, while maintaining pin-to-pin compatibility within specific family subsets.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Evaluate the A5EC008BB23AE6S for potential functional equivalence regarding logic density and processor cores, though thermal specifications may differ.