A5EC013BB23AE6X

Soc System On Chip Overview

The Altera A5EC013BB23AE6X is a System on Chip Field Programmable Gate Array belonging to the Agilex 5 E-Series. It integrates an FPGA fabric with embedded ARM Cortex-A76 and Cortex-A55 processors. The device features 138,000 logic elements and supports high-speed operation at frequencies up to 1.8 GHz for the application processor cluster. It utilizes a 795-lead Very Thin Fine-Pitch Ball Grid Array package measuring 23x23 mm. The component includes integrated peripherals such as DDR controllers, DMA engines, PCIe interfaces, and watchdog timers.

Soc System On Chip Feature Summary

• Agilex 5 E-Series architecture with 138K logic elements
• Dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 MPCore processors
• Integrated peripherals including DDR, DMA, PCIe, and WDT
• Operating junction temperature range of -40°C to 100°C

Soc System On Chip Applications

• Edge computing systems requiring low power consumption
• Industrial automation and control applications
• Embedded sensor processing units

Soc System On Chip Procurement Notes

Verify the specific suffix AE6X against official datasheets to confirm package dimensions and thermal characteristics. Confirm moisture sensitivity level (MSL 3) requirements for handling during assembly. Check for customer advisories such as ADV0051 regarding any known operational constraints or updates affecting this specific part number before finalizing procurement plans.

Soc System On Chip Selection Notes

Select this model when a balance of moderate logic density (138K LEs) and advanced Arm processor performance is required within a compact footprint. Compare against other Agilex 5 E-Series variants like A5EA or A5ED if different I/O counts or package sizes are needed. Ensure the design accommodates the 795-ball VFBGA package constraints and thermal dissipation needs for the specified operating temperature range.

Soc System On Chip Part Context

This component is part of Intel's Agilex 5 E-Series portfolio, designed for cost-sensitive and power-efficient edge applications. It shares architectural similarities with other E-Series devices but offers specific logic capacity and pinout configurations tailored for embedded systems. The series emphasizes scalability from 50KLE to 656KLE across the family.