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The ABB25DYFN-S1355 is a dual-sided card edge connector manufactured by Sullins Connector Solutions. It features 50 total positions arranged in two rows of 25 contacts each, with a 0.050-inch (1.27mm) centerline spacing. Designed for surface mount installation, the connector utilizes solder termination and cantilever contact types. The housing is constructed from polyamide PA9T nylon, colored black, and supports a card thickness of 0.062 inches (1.57mm). Contacts are made of beryllium copper with a gold plating thickness of 10.0µin (0.25µm), ensuring reliable electrical performance within an operating temperature range of -65°C to 150°C.
Verify that the specific suffix DYFN corresponds to the required surface mount footprint and contact orientation, as variations exist within the product family. Confirm compliance with RoHS 3 standards if restricted substances are a constraint. Ensure the procurement channel provides original manufacturer documentation to validate the part number against the official Sullins Connector Solutions catalog specifications before finalizing orders.
Select this component when a dual-sided, surface-mount connection is required for a 0.062-inch thick PCB. The 0.050-inch pitch allows for moderate density without requiring fine-pitch manufacturing capabilities. Consider the beryllium copper material for applications needing high fatigue resistance in the cantilever contacts. Verify that the operating environment remains within the specified -65°C to 150°C range to maintain material integrity and contact performance.
This model belongs to the ABB series of card edge connectors from Sullins Connector Solutions. The series offers various position counts and termination styles, including through-hole and surface mount options. The ABB25 variant specifically addresses mid-range density needs with 50 positions, balancing space constraints with connectivity requirements for standard edge-card applications.
Direct substitutes include other Sullins models with identical 50-position dual-sided surface mount specifications, such as those sharing the same 0.050-inch pitch and 0.062-inch card thickness compatibility. Cross-manufacturer replacements require strict verification of mating dimensions, contact force characteristics, and PCB footprint alignment to ensure mechanical and electrical interchangeability.