ABBK00160808121Y00

Overview

The ABBK00160808121Y00 is a multilayer ferrite chip bead manufactured by Pulse Electronics, designed for surface-mount applications. It features a 0603 (1608 metric) package with dimensions of 1.6 mm length, 0.8 mm width, and 0.8 mm height. The component provides an impedance of 120 Ohms at a test frequency of 100 MHz with a tolerance of ±25%. It supports a maximum DC current of 300 mA and has a maximum DC resistance of 150 mOhms. The device operates within a temperature range of -55°C to +125°C and is shielded.

Feature Summary

• Multilayer construction for compact surface-mount integration
• Shielded design to minimize electromagnetic interference
• High current handling capability relative to package size

Applications

• Power line filtering in portable electronics
• Signal integrity management in high-speed digital circuits
• EMI suppression in automotive electronic modules

Procurement Notes

Verify the specific manufacturer part number against official Pulse Electronics documentation to ensure accuracy. Confirm that the required electrical parameters, including impedance and current ratings, match the application requirements. Check for RoHS compliance status and moisture sensitivity level details in the latest datasheet before procurement.

Selection Notes

Select this component when a shielded ferrite bead with moderate impedance is required for 0603 footprint constraints. Ensure the operating current does not exceed the rated maximum to prevent performance degradation. Consider the temperature coefficient and DC resistance impact on circuit efficiency during selection.

Part Context

This part belongs to the ABBK series of multilayer ferrite chip beads from Pulse Electronics. The series offers various impedance values and current ratings within standard SMD packages. The ABBK00160808121Y00 specifically targets applications requiring 120 Ohms shielding in a compact form factor.

Replacement Considerations

Cross-reference with other 0603 ferrite beads offering similar impedance and current ratings. Verify compatibility with existing PCB footprints and soldering profiles. Ensure substitute components meet the same shielding and temperature specifications.