ABSY00100505300Y00

Overview

The ABSY00100505300Y00 is a multilayer ferrite chip bead manufactured by Pulse Electronics, designed for surface-mount technology applications. It features a 0402 (1005 metric) package with dimensions of 1.0 mm length and 0.5 mm width. The component provides an impedance of 30 ohms at 100 MHz with a tolerance of 25%. It supports a maximum DC current of 500 mA and has a maximum DC resistance of 200 milliohms. The device operates within a temperature range of -55°C to +125°C.

Feature Summary

• Shielded construction to minimize electromagnetic interference coupling
• Multilayer ceramic structure for compact surface-mount integration
• High current handling capability suitable for power line filtering

Applications

• DC power line noise suppression in portable electronics
• Signal integrity enhancement in high-speed digital circuits
• Electromagnetic compatibility filtering in communication modules

Procurement Notes

Verify the specific ordering suffix against the manufacturer's latest datasheet to ensure correct impedance and current ratings. Confirm RoHS compliance status and packaging details directly with authorized distributors. Cross-reference the Mouser part number 673-ABSY100505300Y00 for accurate sourcing information.

Selection Notes

Select this component when a shielded ferrite bead is required in a 0402 footprint for space-constrained designs. Ensure the operating current does not exceed 500 mA to prevent saturation. Verify that the 30-ohm impedance at 100 MHz aligns with the target noise frequency spectrum for effective attenuation.

Part Context

This part belongs to the ABSY series of shielded multilayer ferrite beads from Pulse Electronics. The series is engineered for high-density PCB layouts where shielding prevents magnetic field leakage. It complements other BBSY and BBSJ variants offering different impedance profiles and package sizes.

Replacement Considerations

Direct substitutes include the BBSY00100505300Y00, which shares similar electrical characteristics but may differ in shielding specifications. Evaluate mechanical fit and thermal performance before swapping components within the same package family.