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The ABUP00201209301Y00 is a multilayer ferrite chip bead manufactured by Pulse Electronics, designed for EMI suppression in power line applications operating under 1 GHz. It features an 0805 (2012 metric) surface-mount package with dimensions of 2 mm length, 1.2 mm width, and 0.9 mm height. The component provides an impedance of 300 Ohms at a test frequency of 100 MHz with a tolerance of 25%. It supports a maximum DC current of 3 A and has a maximum DC resistance of 50 mOhms. The device operates within a temperature range of -55 °C to +125 °C.
Verify the specific impedance value and current rating against the official datasheet before integration. Confirm RoHS compliance status and packaging details such as reel or cut tape options directly with the manufacturer or authorized distributors. Ensure the selected variant matches the required thermal and electrical specifications for the target application environment.
Select this component when shielding is required to prevent magnetic field coupling in dense circuit designs. The 3A current rating makes it suitable for moderate-power rails where low DC resistance is critical to minimize voltage drop. Consider the 0805 package size relative to available board space and soldering capabilities.
This part belongs to the BBUP/ABUP series of multilayer ferrite beads from Pulse Electronics. These components are engineered for EMI suppression in high-frequency environments. The series offers various impedance values and current ratings across different package sizes to accommodate diverse power and signal integrity requirements in modern electronic systems.
Cross-reference with other 0805 ferrite beads offering 300 Ohms impedance at 100 MHz and similar current handling capabilities. Verify that any substitute maintains the same shielded construction and thermal performance characteristics.