SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ABUP00201209331Y00 is a shielded ferrite bead from the ABUP series manufactured by Pulse Electronics. It features a 0805 (2012 Metric) surface mount package with dimensions of 2.00 mm length, 1.25 mm width, and 1.10 mm maximum height. The component provides an impedance of 330 Ohms at a test frequency of 100 MHz and supports a rated DC current of 3 A. Its maximum DC resistance is 50 mOhms, and it operates within a temperature range of -55°C to +125°C. This part is qualified under AEC-Q200 standards for automotive applications.
Verify the manufacturer designation carefully as distribution sources may list this part under alternative branding such as Chilisin Electronics despite the official Pulse Electronics model number. Confirm the specific impedance tolerance and current rating requirements against the official datasheet before finalizing procurement orders to ensure compatibility with system specifications.
Select this component when a shielded ferrite bead is required for high-current power lines in space-constrained environments. The 0805 footprint offers a balance between current capacity and board area efficiency. Ensure the application demands the specific 330 Ohm impedance characteristic at 100 MHz and can accommodate the 3 Ampere continuous current rating without exceeding thermal limits.
This component belongs to the ABUP series of ferrite beads from Pulse Electronics, specifically engineered for automotive and industrial applications requiring robust EMI suppression. The series is characterized by its shielded design and high current ratings, making it suitable for modern electronics where signal integrity and noise reduction are critical in dense circuit layouts.
Cross-reference with other 0805 ferrite beads offering 330 Ohms impedance and 3A current ratings. Verify that any substitute maintains the same AEC-Q200 qualification if automotive use is intended. Check physical dimensions and terminal configurations to ensure mechanical compatibility with existing PCB footprints.