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ACAG1204-915-T is listed in the Antennas RF range at ChipApex. The manufacturer field lists Abracon LLC. Its product description is RF ANT 915MHZ CHIP SOLDER SMD. Review the specifications below when checking this part for your BOM.
The ACAG1204-915-T is a ceramic surface-mount chip antenna manufactured by Abracon LLC. Designed for low-power wide-area network (LPWAN) applications, this component operates at a center frequency of 915 MHz with a 50 Ohm impedance. It features omnidirectional radiation characteristics and linear polarization within a compact package measuring 12mm x 4mm x 1.6mm. The device supports an operating temperature range from -40°C to +85°C, ensuring reliability in industrial environments.
Verify the specific datasheet version provided by the manufacturer or authorized distributor to confirm current technical specifications and compliance certifications. Ensure that the ordering suffix matches the required tape-and-reel packaging configuration. Cross-reference the part number against official Abracon databases to validate authenticity and avoid counterfeit components during the sourcing process.
Select this component when designing systems requiring compact, surface-mount antennas for 915 MHz ISM bands. Consider its physical dimensions and thermal range relative to the host PCB layout and environmental conditions. Evaluate compatibility with LoRa, NB-IoT, or SigFox protocols to ensure optimal signal integrity and performance within the intended application scope.
This model belongs to Abracon's LPWAN antenna portfolio, which includes ceramic SMD chip, patch, and external whip types. These solutions target global ISM frequencies, supporting connectivity standards such as LoRa, NB-IoT, and SigFox. The series emphasizes miniaturization and high gain for efficient wireless transmission in constrained IoT form factors.
Consult official Abracon documentation for verified substitute part numbers. Do not assume interchangeability based on generic specifications alone. Verify impedance, frequency, and physical footprint alignment before implementing any alternative components in existing designs.
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