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Product Detailed Parameters
- Description:DIODE STANDARD 600V 1A 1206
- Series:-
- Mfr:Comchip Technology
- Package:Tape & Reel (TR),Cut Tape (CT)
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):600 V
- Current - Average Rectified (Io):1A
- Voltage - Forward (Vf) (Max) @ If:1.7 V @ 1 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):35 ns
- Current - Reverse Leakage @ Vr:5 µA @ 600 V
- Capacitance @ Vr, F:10pF @ 4V, 1MHz
- Mounting Type:Surface Mount
- Package / Case:2-SMD, No Lead
- Supplier Device Package:1206
- Operating Temperature - Junction:-65°C ~ 175°C
- Grade:Automotive
- Qualification:AEC-Q101
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Overview
The ACEFN103-HF is a surface-mount fast recovery rectifier manufactured by Comchip Technology. It features a 600 V maximum DC reverse voltage and supports an average forward current of 1 A. The component utilizes a 2-SMD, No Lead package with a 1206 footprint. It is certified to the AEC-Q101 automotive reliability standard. The device employs a glass passivated chip junction for enhanced stability. Terminals are pure tin plated and lead-free, ensuring solderability per MIL-STD-750 standards.
Feature Summary
- AEC-Q101 qualified for automotive electronic applications
- Glass passivated chip junction construction
- Lead-free pure tin plated terminals
Applications
- Automotive power supply circuits
- General purpose rectification in surface mount assemblies
- High frequency switching applications
Procurement Notes
Verify the specific datasheet version when sourcing, as manufacturing specifications may evolve. Confirm that the required packaging format matches the project needs, as reel or cut tape options may vary by distributor. Ensure the supplier provides traceability documentation consistent with automotive quality requirements. Check for any regional distribution restrictions before finalizing procurement plans.
Selection Notes
Select this component when a 600 V rating and 1 A continuous current capacity are required in a compact 1206 footprint. The AEC-Q101 certification makes it suitable for automotive environments where high reliability is mandatory. Consider the glass passivation for improved junction stability compared to non-passivated alternatives. Evaluate thermal management requirements based on the low-profile surface mount package constraints.
Part Context
This part belongs to Comchip Technology's line of surface mount discrete semiconductors. The manufacturer specializes in flat chip packaging technologies compliant with RoHS directives. The product series targets applications requiring high efficiency and small form factors. Comchip utilizes gold termination processes in some lines, though this specific variant uses pure tin plating for terminal compatibility.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material.
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