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The ACF321825-330-TD01 is a third-order low-pass LC (T-type) EMI filter designed for surface mount applications. It features a single channel with a rated voltage of 20V and a maximum current handling capacity of 300mA. The component utilizes a 1210 (3225 Metric) package with three PCB pads, measuring 3.20mm in length, 2.50mm in width, and 2.00mm in height. It provides an attenuation value of 25dB at frequencies ranging from 500MHz to 600MHz. The device operates within a temperature range of -25°C to 85°C and has a channel resistance of 0.15 Ohms.
Verify component availability as the manufacturer lists this part number as obsolete or discontinued. Confirm end-of-life status with authorized distributors before finalizing design implementations. Ensure that any remaining stock meets RoHS3 compliance standards and check for potential supply chain restrictions or shipping limitations in specific regions. Validate datasheet revisions to ensure technical specifications remain consistent with original design requirements.
Select this component for applications requiring third-order attenuation in a small SMD package. Consider the 300mA current rating and 20V voltage limit when designing power paths. The 0.15 Ohm resistance should be accounted for in signal integrity calculations. Verify that the 1210 package dimensions fit within the available board space constraints for the target mobile device application.
This component belongs to the TDK ACF series of EMI filters, which are specialized for suppressing electromagnetic interference in high-speed data lines. The series offers various cutoff frequencies and current ratings tailored for mobile and portable electronic devices. The ACF321825-330-TD01 specifically targets higher frequency noise suppression compared to lower cutoff variants in the same family.
Public confirmed substitute part numbers are not provided in the source documentation. Due to the obsolete status, direct replacements must be identified through independent engineering analysis of electrical parameters and physical footprint compatibility.