ACF451832-470-TD01

Overview

The ACF451832-470-TD01 is a single-channel low-pass LC filter designed for signal line EMI suppression. It operates within a frequency range of 360 MHz to 460 MHz, providing an attenuation of 25 dB. The component features a voltage rating of 50 V and a current rating of 300 mA. It utilizes an LC (T) circuit topology and is housed in a 1812 (4532 metric) surface-mount package. The device supports operation temperatures from -25°C to 85°C.

Feature Summary

• Integrates ferrite chip beads with multilayer ceramic capacitors for compact EMC filtering
• Provides effective high-frequency noise suppression for single-ended data lines
• Designed for surface-mount assembly in space-constrained mobile applications

Applications

• EMI filtering for mobile device data lines
• Signal line protection in portable electronics
• High-frequency noise suppression in consumer hardware

Procurement Notes

Verify the specific suffix TD01 against official TDK documentation to confirm packaging details and availability status. As this component may be discontinued or subject to supply constraints, cross-reference the manufacturer's latest lifecycle notices. Ensure that the selected variant matches the required attenuation characteristics and thermal ratings for the target application environment before finalizing procurement orders.

Selection Notes

Select this component for single-ended signal paths requiring targeted attenuation between 360 MHz and 460 MHz. For differential signaling applications, utilize matched pairs of identical units to maintain symmetry. Ensure the operating temperature range of -25°C to 85°C aligns with the system's environmental requirements. Verify that the 50 V voltage rating and 300 mA current capacity exceed the maximum expected line conditions to prevent component failure.

Part Context

This part belongs to the TDK ACF series, which combines ferrite beads and ceramic capacitors into a single SMD package. The series is engineered for efficient electromagnetic compatibility in small form factors. The 1812 footprint allows for automated placement in high-volume manufacturing processes typical of modern mobile and consumer electronic devices.

Replacement Considerations

Consult official TDK substitution guides for compatible alternatives. No public substitute part numbers are confirmed in the provided source material.