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The ACH4518-152-TD01 is a surface-mount EMI filter circuit manufactured by TDK Corporation. It utilizes an LC (T) topology designed for signal and DC power line applications. The component features a rated voltage of 50 V and a current rating of 2 A. Key electrical parameters include a capacitance of 0.015 uF, a cutoff frequency of 100 MHz, and an attenuation of 25 dB within the 50 MHz to 130 MHz range. It operates within a temperature range of -40°C to +125°C and is housed in a 1812 (4532 metric) package with three pads.
This component is officially listed as End-of-Life (EOL) and no longer manufactured by TDK. Verification of availability should focus on authorized distributors holding remaining stock or approved replacement parts. Ensure compliance with RoHS3 specifications if sourcing from secondary markets. Confirm that substitute components meet identical electrical ratings and physical dimensions to maintain circuit integrity.
Select this component when designing circuits requiring high-current EMI filtering in a compact footprint. The 2 A rating suits power lines carrying significant load, while the 50 V rating defines the voltage ceiling. The LC (T) structure offers specific impedance matching characteristics compared to other topologies. Verify that the 1812 package fits the PCB layout constraints and that the thermal environment stays within the specified -40°C to +125°C operational limits.
The ACH4518 series represents TDK's line of large current EMI filters. These components are engineered for surface-mount technology, providing reliable noise reduction in modern electronic assemblies. The ACH4518-152-TD01 specifically denotes the variant with 0.015 uF capacitance, distinguishing it from other members of the family such as the ACH4518-153-TD01 or ACH4518-471-TD01 which feature different capacitance values and cutoff frequencies.
TDK recommends the YFF18SC1H472MT0H0N as a manufacturer-recommended substitute for this discontinued part. Verify that the alternative matches the required current, voltage, and form factor before integration.