ACML-0805-360-T

Overview

The Abracon ACML-0805-360-T is a surface-mount ferrite chip bead from the ACML series, designed for electromagnetic interference suppression. It features an impedance of 36 Ohms at 100 MHz and supports a maximum DC current of 1.5 A with a maximum DC resistance of 50 mOhms. The component utilizes an unshielded 0805 (2012 metric) package measuring 2 mm in length, 1.25 mm in width, and 0.85 mm in height. It operates within a temperature range of -55°C to +125°C and complies with RoHS standards.

Feature Summary

• Provides effective high-frequency noise attenuation through ferrite material properties
• Supports high continuous DC current loads up to 1.5 Amperes
• Offers low insertion loss via minimal DC resistance characteristics
• Compatible with standard surface mount assembly processes

Applications

• Power supply line filtering
• Data bus noise suppression
• Clock signal conditioning
• General-purpose EMI suppression circuits

Procurement Notes

Verify the specific impedance tolerance and DC resistance values against the official manufacturer datasheet prior to final design approval. Confirm that the selected packaging format aligns with automated placement equipment requirements. Ensure thermal management strategies account for power dissipation under maximum rated current conditions to maintain operational reliability within the specified temperature range.

Selection Notes

Select this component when circuit designs require moderate impedance attenuation at 100 MHz combined with high current handling capabilities. The 0805 footprint provides a balance between physical size and thermal performance compared to smaller packages. Consider the unshielded construction for applications where magnetic field interaction with nearby components must be minimized or managed through layout spacing.

Part Context

This part belongs to the Abracon ACML series of ferrite chip beads, which are engineered for broadband noise suppression in electronic circuits. The series offers various impedance ratings and current capacities across multiple standard package sizes, allowing designers to tailor EMI solutions to specific board space and electrical constraints without compromising signal integrity.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult manufacturer cross-reference tools or equivalent product specifications from other suppliers to identify compatible alternatives based on impedance, current rating, and package dimensions.