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The ACPL-5631L-200 is a high-speed, dual-channel logic output optocoupler manufactured by Broadcom Limited. It features a hermetically sealed ceramic DIP-8 package with gold-plated leads, designed for Class H reliability. The device operates at a data rate of 10 MBd with a common mode transient immunity (CMTI) of 1 kV/µs. Key electrical parameters include a forward current of 20 mA, forward voltage of 1.5 V, and reverse voltage of 5 V. Output characteristics consist of an open collector configuration with Schottky clamping. Power dissipation is rated at 200 mW, with rise and fall times of 90 ns and 40 ns respectively.
Verify the specific ordering suffix to confirm package type and reel quantity specifications. Ensure compatibility with existing PCB footprints for the 8-DIP ceramic package. Confirm that the hermetic seal meets the required environmental standards for the intended application environment. Cross-reference datasheet revisions to ensure parameter consistency with previous design iterations.
Select this component when high-speed digital isolation is required alongside strict environmental durability. The dual-channel architecture reduces board space compared to single-channel alternatives. Verify that the 10 MBd data rate aligns with system timing requirements. Consider the ceramic package's thermal and mechanical properties if operating in harsh conditions where plastic packages may fail.
This part belongs to the ACPL-5631L series of high-reliability optocouplers. It shares functional similarities with other models in the family but differs in packaging and specific electrical tolerances. The series is characterized by its use in critical applications where failure is not an option, leveraging advanced semiconductor processes for longevity and signal integrity.
ACPL-5631L-000 serves as a direct substitute within the same product line, offering identical electrical characteristics and pinout configurations. Verify package availability and lead finish specifications when substituting to ensure mechanical compatibility.