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The Broadcom ACPL-W21L-000E is a single-channel high-speed digital optocoupler housed in a stretched SOIC-6 package. It features a push-pull totem pole output capable of sourcing and sinking 10 mA per channel. The device supports data rates up to 5 MBd with propagation delays of 250 ns maximum for both low-to-high and high-to-low transitions. It operates within a supply voltage range of 2.7 V to 5.5 V and provides an isolation voltage of 5000 Vrms. Common mode transient immunity is rated at 25 kV/µs, ensuring reliable signal transmission in noisy environments.
Verify the specific ordering suffix matches the required package variant and lead-free status. Confirm that the stretched SOIC-6 footprint aligns with the target PCB layout constraints. Ensure the operating temperature range meets the environmental requirements of the end application. Cross-reference the datasheet revision date to guarantee access to the most current electrical specifications and mechanical drawings before finalizing procurement orders.
Select this component when a single isolated channel with active push-pull output is required for speeds up to 5 MBd. The 5000 Vrms isolation rating suits applications demanding significant potential difference separation between input and output circuits. Consider the 6-pin SOIC package size if board space is limited compared to standard 8-pin configurations. Evaluate the 2.7 V to 5.5 V supply range compatibility with existing system logic levels.
This part belongs to the ACPL-x2xL family of 5 MBd digital optocouplers from Broadcom. It shares core electrical characteristics with other members like the ACPL-W22L but differs in pin count and channel configuration. The stretched SOIC-6 package distinguishes it from wider SOIC variants, offering a compact solution for high-density circuit designs while maintaining the same high-speed performance metrics.
Direct substitutes include the ACPL-W22L-000E for dual-channel requirements or the ACPL-054L-000E for similar isolation specs in an 8-pin package. Verify pinout compatibility and thermal characteristics when swapping between different package styles within the ACPL series.