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The ACS37800KMACTR-030B3-SPI is a board-mount current sensor IC from Allegro MicroSystems designed for DC and AC applications. It features a Hall-effect sensing technology with a digital SPI output interface. Key electrical parameters include a 30 A current rating, 400 kHz frequency range, and 1.2% accuracy. The device operates within a supply voltage range of 2.97 V to 3.63 V and has a response time of 5 us. It is housed in a WSOIC-16 package measuring 10.21 mm in length, 7.5 mm in width, and 2.54 mm in height. The operational temperature range spans from -40 C to +125 C.
Verify the specific suffix 'SPI' confirms the serial peripheral interface communication protocol required by your design. Confirm the '030B3' designation aligns with the necessary 30 A current rating and accuracy specifications. Ensure the WSOIC-16 package dimensions fit your PCB layout constraints. Check manufacturer documentation for any recent product change notifications affecting pinout or electrical characteristics before finalizing procurement.
Select this component when a digital SPI interface is preferred over analog outputs for noise immunity and simplified signal conditioning. The 30 A rating suits moderate power applications requiring high accuracy. Consider the 400 kHz bandwidth for dynamic load monitoring. Verify that the 2.97 V to 3.63 V supply voltage matches your system's logic levels. The wide operating temperature range supports harsh industrial environments.
This part belongs to the ACS37800 series of power, voltage, and current sensor ICs. It shares the same core Hall-effect technology and packaging as the I2C variant (ACS37800KMACTR-030B3-I2C), differing primarily in the digital communication protocol. The series targets high-performance sensing needs in automotive and industrial sectors where precise real-time data acquisition is critical.
The ACS37800KMACTR-030B3-I2C serves as a functional substitute if the application can accommodate an I2C interface instead of SPI. Both parts share identical electrical ratings, package dimensions, and core sensing capabilities. Ensure software drivers are updated to support the alternative communication protocol before swapping components.