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ACS770LCB-100U-PFF-T is listed in the Current Sensors range at ChipApex. The manufacturer field lists Allegro MicroSystems. Its product description is SENSOR CURRENT HALL 100A DC. Review the specifications below when checking this part for your BOM.
The ACS770LCB-100U-PFF-T is a fully integrated, thermally enhanced Hall effect current sensor IC from Allegro Microsystems. It features a 100A unidirectional measurement range with a sensitivity of 40mV/A and an offset voltage of ±6mV. The device operates on a 5V supply (4.5V to 5.5V) and provides an analog output. Key electrical parameters include a bandwidth of 120kHz, a response time of 4.6µs, and linearity of ±1%. It is housed in a 5-pin PFF package designed for through-hole mounting.
Verify the specific suffix 'U' indicates the unidirectional variant with 100A rating. Confirm the 'PFF' package designation matches the required through-hole footprint. Ensure the manufacturer is Allegro MicroSystems. Check RoHS compliance status if required by project specifications. Validate that the operating temperature range meets environmental requirements.
Select this component for high-precision DC current monitoring where galvanic isolation is necessary. The 40mV/A sensitivity allows for straightforward signal conditioning. Consider the 120kHz bandwidth for dynamic load applications. The wide operating temperature range supports harsh environments. Ensure the PCB layout accommodates the thermal pad requirements for optimal performance.
This part belongs to the ACS770xCB series of current sensors. It shares the same package style as other variants but differs in current rating and directionality. The series is known for its integrated copper conduction path and Hall element. It serves as a direct replacement for older discrete current sensing solutions in compact designs.
Direct substitutes within the same series include ACS770LCB-050U-PFF-T for lower current ratings. For bidirectional applications, consider the ACS770LCB-100B-PFF-T variant. Verify pinout compatibility when replacing similar packages. Check datasheet updates for any recent material changes.
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