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The ACST210-8BTR is a surface-mount overvoltage protected AC switch from STMicroelectronics, belonging to the ACS/ACST power switch family. It features a Triac structure with integrated high voltage clamping technology for absorbing inductive turn-off energy and withstanding line transients per IEC 61000-4-5 standards. The device operates with an on-state RMS current of 2 A and supports a repetitive peak reverse voltage of 800 V. It requires a low gate trigger current (IGT max 10 mA) and offers high electrical noise immunity with a static dV/dt rating exceeding 500 V/µs at 125 °C. Packaged in DPAK (TO-252), it functions within a junction temperature range of -40 °C to +125 °C.
Verify the specific ordering suffix 'TR' corresponds to tape and reel packaging containing 2500 units per base quantity. Confirm that the component meets ECOPACK environmental compliance specifications required for the target assembly process. Ensure the design accounts for the thermal resistance characteristics of the DPAK package under the expected operating conditions.
Select this component when driving inductive loads up to 2 A that require robust protection against AC line transients. The logic-level sensitivity allows direct interfacing with standard microcontroller outputs via a simple resistor. Verify that the 800 V blocking voltage aligns with the maximum mains voltage peaks expected in the application environment.
This part belongs to the ACST2 series, which utilizes Application Specific Discrete (A.S.D.) technology. The series includes variants like the ACST210-8FP in insulated packages. The ACST210-8BTR specifically denotes the DPAK surface-mount configuration designed for automated assembly processes while maintaining the high reliability and transient protection features of the broader ACST family.
The ACST210-8B is the tube-packaged equivalent of this component. Both share identical electrical ratings and functional characteristics. Substitution between these two variants is valid provided the manufacturing process accommodates the respective packaging formats.