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The AD13465AF is a dual-channel, 14-bit Analog-to-Digital Converter (ADC) manufactured by Analog Devices Inc. It utilizes a proprietary conversion method and supports parallel data access. The device is housed in a 68-lead Ceramic Quad Flat Package (CQFP) with a non-conductive tie bar, classified as LCC-68. It operates within an industrial temperature range of -25°C to +85°C. The analog input voltage range spans from -1 V to +1 V, requiring nominal negative supply voltages of -5 V. The component features two functional units within a single package, delivering 14-bit resolution with 2's complement binary output format.
Verify the specific suffix 'AF' against official Analog Devices documentation to confirm ceramic packaging and lead-free status. Check RoHS compliance records as some legacy ceramic packages may have different environmental declarations than modern plastic variants. Confirm availability through authorized distributors, noting that older ceramic packages may have limited production runs or be subject to last-time-buy notices.
Select this component when dual-channel 14-bit resolution is required with a parallel interface. Ensure the system design accommodates the -5 V negative supply requirement and the ±1 V analog input range. Verify that the PCB layout supports the 68-lead ceramic QFP footprint and thermal management for the specified industrial temperature range. Compare against newer plastic-packaged alternatives if cost or volume constraints apply.
This part belongs to Analog Devices' high-performance ADC portfolio, specifically designed for applications demanding precision and speed. The use of a ceramic package suggests suitability for harsh environments or high-reliability applications where hermetic sealing or mechanical stability is prioritized over the smaller form factors of modern plastic packages.
Direct pin-compatible replacements are not explicitly listed in public general catalogs. Evaluate newer ADI ADC families with similar resolution and parallel interfaces, such as the AD94xx series, though package changes will require schematic and layout modifications.