AD5675RARUZ

Overview

The AD5675RARUZ is an octal, 16-bit buffered voltage output digital-to-analog converter (DAC) from the nanoDAC+ family. It features a 2.5 V internal reference with a typical temperature coefficient of 2 ppm/°C and operates on a single 2.7 V to 5.5 V supply. The device includes a gain select pin for full-scale outputs of 2.5 V or 5 V. It utilizes a 400 kHz I²C-compatible serial interface and guarantees monotonicity by design. Packaged in a 20-lead TSSOP, it incorporates power-on reset and power-down modes reducing current consumption to 1 μA typical.

Feature Summary

• Octal 16-bit resolution with high relative accuracy (INL ±3 LSB max at A Grade)
• Integrated 2.5 V reference with low drift (2 ppm/°C typical)
• User-selectable gain of 1 or 2 via GAIN pin
• I²C interface with 1.8 V logic compatibility

Applications

• Optical transceivers
• Base station power amplifiers
• Process control PLC input/output cards
• Industrial automation systems
• Data acquisition systems

Procurement Notes

Verify the specific grade (A or B) required for your application, as INL and gain error specifications differ between grades. Confirm the package type matches the RU-20 TSSOP outline dimensions. Ensure the design accounts for the exposed pad connection to ground for thermal performance and electrical grounding.

Selection Notes

Select the AD5675RARUZ when eight independent 16-bit channels are needed with integrated precision referencing. Choose this part over external reference designs to save board space and simplify layout. Verify that the I²C address configuration via A0/A1 pins fits within the system bus constraints.

Part Context

This component belongs to the AD567xR series of octal nanoDACs. It shares architectural similarities with the AD5676R but differs in its I²C interface compared to the SPI-based variants. The 'R' suffix indicates the inclusion of an internal reference, while 'ARU' specifies the A-grade performance level and TSSOP packaging.

Replacement Considerations

The AD5675RACPZ-RL serves as a functional replacement offering identical electrical characteristics but utilizes a 20-lead LFCSP package instead of TSSOP. Designers must adjust PCB footprint and thermal vias accordingly when substituting this package variant.