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Product Detailed Parameters
- Description：IC DAC 16BIT V-OUT 20LFCSP
- Series：nanoDAC+®
- Mfr：Analog Devices Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- Number of Bits：16
- Number of D/A Converters：8
- Settling Time：8µs
- Output Type：Voltage - Buffered
- Differential Output：No
- Data Interface：SPI, DSP
- Reference Type：Internal
- Voltage - Supply, Analog：2.7V ~ 5.5V
- Voltage - Supply, Digital：1.8V ~ 5.5V
- INL/DNL (LSB)：±1.8, ±0.7
- Architecture：String DAC
- Operating Temperature：-40°C ~ 125°C
- Package / Case：20-WFQFN Exposed Pad, CSP
- Supplier Device Package：20-LFCSP (4x4)
- Mounting Type：Surface Mount
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Overview
The AD5676RBCPZ-REEL7 is an octal, 16-bit buffered voltage output digital-to-analog converter (DAC) from the nanoDAC+ family. It integrates a low-drift 2.5 V internal reference with a typical temperature coefficient of 2 ppm/°C and features a user-selectable gain of 1 or 2, enabling full-scale outputs of 2.5 V or 5 V. The device operates on a single 2.7 V to 5.5 V supply and supports SPI interfaces up to 50 MHz. Packaged in a 20-lead LFCSP, it includes power-on reset circuits and individual channel power-down modes that reduce current consumption to 1 µA typical.
Feature Summary
- Octal 16-bit resolution with ±3 LSB maximum INL
- Integrated 2.5 V reference with 2 ppm/°C drift
- SPI interface supporting 50 MHz clock rates
- 20-lead LFCSP package with exposed pad
Applications
- Optical transceivers
- Base station power amplifiers
- Process control PLC input/output cards
- Industrial automation systems
- Data acquisition systems
Procurement Notes
Verify the specific grade (A or B) and suffix details against the manufacturer's ordering guide, as performance parameters like INL and offset error vary between grades. Confirm the LFCSP package orientation and thermal pad connection requirements during procurement review.
Selection Notes
Select this component for applications requiring high channel density and integrated precision references. Ensure the system logic voltage aligns with the VLOGIC pin range of 1.62 V to 5.5 V. Consider the thermal resistance characteristics of the LFCSP package for PCB layout planning under continuous operation.
Part Context
This part belongs to the AD567xR series, which shares architectural similarities with the AD5671R, AD5675R, and AD5676R. Key differentiators include the 16-bit resolution and SPI interface compared to the I2C-based AD5671R/AD5675R or the external reference variants.
Replacement Considerations
The AD5676ARUZ serves as a pin-compatible alternative in a TSSOP-20 package. Verify that the thermal dissipation capabilities of the TSSOP package meet the application's requirements when substituting the LFCSP version.
