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The AD5761RARUZ is a single-channel, 16-bit serial input voltage output digital-to-analog converter (DAC) from Analog Devices Inc. It features an integrated low-drift 2.5 V reference with ±2 ppm/°C typical drift and dual reference buffers. The device supports eight software-programmable output ranges, including unipolar (0 V to +5 V/+10 V/+16 V/+20 V) and bipolar (±3 V/±5 V/±10 V, −2.5 V to +7.5 V) configurations with 5% overrange capability. Key electrical specifications include a maximum total unadjusted error (TUE) of 0.1% FSR, guaranteed monotonicity within ±1 LSB, and a typical settling time of 7.5 μs. It operates on a digital supply of 1.7 V to 5.5 V and analog supplies up to ±16.5 V or single supply up to 30 V.
Verify the package type matches the required form factor, as the AD5761R series is available in both 16-lead TSSOP and 3 mm × 3 mm LFCSP packages. Confirm that the specific suffix 'RARUZ' corresponds to the intended packaging and tape-and-reel quantity if applicable. Ensure the operating environment stays within the specified industrial temperature range of −40°C to +125°C for guaranteed performance parameters.
Select this component when a high-precision, single-channel DAC with integrated reference is required. The 16-bit resolution and low glitch impulse (1 nV-sec in 0 V to 5 V range) make it suitable for sensitive applications. Consider the power supply requirements; while it supports wide analog supply ranges, ensure the digital interface voltage (DVCC) is compatible with the host microcontroller or DSP logic levels.
The AD5761R is part of the AD5761R/AD5721R family, which also includes the 12-bit AD5721R variant. Both share identical pinouts, serial interfaces, and most functional blocks, differing primarily in resolution and accuracy grades. The AD5761R provides higher precision with A Grade INL specifications compared to the B Grade typically associated with the 12-bit version.
The AD5721R is a direct pin-compatible alternative offering 12-bit resolution. For replacements requiring similar functionality but different packages, verify thermal impedance differences between TSSOP and LFCSP variants. No other cross-model substitutes are explicitly confirmed in the provided documentation.