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The AD667KP is a 12-bit voltage-output digital-to-analog converter (DAC) manufactured by Analog Devices Inc. It features a monolithic design integrating a high-stability buried Zener reference, dual-buffered input latches, and a buffered output amplifier. The device utilizes laser-trimmed thin-film resistors to achieve a maximum linearity error of ±1/4 LSB at +25°C for the K grade. It operates on dual power supplies ranging from ±11.4 V to ±16.5 V, with typical supply currents of 8 mA and 20 mA. The unit is housed in a 28-lead Plastic Leaded Chip Carrier (PLCC) package and supports parallel data interfaces compatible with microprocessor systems.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status as historical records may vary. Check for moisture sensitivity labeling prior to soldering. Ensure storage conditions adhere to specified limits to prevent package degradation. Validate pin compatibility with existing PCB footprints before integration.
Select the AD667KP when a 12-bit resolution with ±1/4 LSB linearity at room temperature is required. This model is suitable for applications operating between 0°C and +70°C. Consider the PLCC-28 package constraints for surface-mount assembly. Evaluate power supply stability requirements against the ±11.4 V to ±16.5 V operational range. Compare settling time specifications against system speed requirements.
The AD667 series represents a family of complete 12-bit DACs designed for high-performance analog applications. The AD667KP specifically denotes the K-grade accuracy variant packaged in a 28-lead PLCC format. It belongs to the broader AD667 product line which includes ceramic DIP and other plastic packages. The device distinguishes itself through integrated trimming and internal reference buffering.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout and electrical parameter compatibility if considering alternative manufacturers. Review thermal performance and package dimensions for mechanical fit.