AD7819YRUZ-REEL

Overview

The AD7819YRUZ-REEL is an 8-bit successive approximation analog-to-digital converter manufactured by Analog Devices Inc. It operates on a single supply voltage ranging from 2.7 V to 5.5 V and supports a maximum throughput of 200 kSPS with a conversion time of 4.5 µs. The device features an internal track-and-hold circuit, an on-chip clock oscillator, and an 8-bit parallel interface. It is housed in a 16-lead Thin Shrink Small Outline Package (TSSOP) and includes automatic power-down functionality to minimize energy consumption at lower sampling rates.

Feature Summary

• Integrated track-and-hold circuitry and on-chip clock oscillator eliminate the need for external timing components.
• Automatic power-down mode activates at the end of each conversion cycle to significantly reduce average power consumption.
• Eight-bit wide parallel interface allows direct connection to microprocessors and DSPs with minimal address decoding logic.

Applications

• Battery-powered instrumentation systems requiring low power consumption
• Microprocessor-based data acquisition systems
• Industrial process control applications

Procurement Notes

Verify that the specific ordering suffix corresponds to the TSSOP-16 package variant rather than other available packages such as SOIC or DIP. Confirm that the reel packaging matches the required quantity specifications for the production line. Ensure compatibility with the intended operating temperature range of -40°C to +125°C before finalizing procurement orders.

Selection Notes

Select this component when an 8-bit resolution and 200 kSPS speed are sufficient for the application requirements. Consider the automatic power-down feature if battery life is a critical constraint in the design. Ensure the system architecture can accommodate an 8-bit parallel data bus and provides the necessary CONVST, CS, and RD control signals for proper interfacing.

Part Context

This part belongs to the AD7819 family of high-speed, microprocessor-compatible ADCs. The YRUZ suffix specifically denotes the Thin Shrink Small Outline Package (TSSOP) variant with lead-free composition. Other variants in the series include plastic DIP and narrow body SOIC packages, offering flexibility for different board layout constraints while maintaining identical electrical performance characteristics.

Replacement Considerations

Direct pin-for-pin replacements within the same package type should be verified against the latest manufacturer datasheets. Alternative parts must match the 8-bit resolution, 200 kSPS throughput, and 2.7 V to 5.5 V supply voltage range. Verify that any substitute maintains the same parallel interface protocol and power-down behavior.