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The AD8392AAREZ-RL is a dual-channel ADSL/ADSL2+ line driver featuring four high-output current amplifiers in a 28-lead TSSOP_EP package. It operates on single supplies from 10 V to 24 V or dual supplies of ±5 V to ±12 V. Key electrical parameters include a 37 MHz small-signal bandwidth, 515 V/µs slew rate, and 500 mA linear output current. The device delivers a 42.6 V p-p differential output swing with low distortion (-93 dBc second harmonic at 1 MHz). Quiescent current ranges from 0.08 mA to 6.5 mA per amplifier depending on the selected power mode.
Verify the specific ordering suffix corresponds to the required reel quantity and packaging format. Confirm RoHS compliance status as indicated by the Z suffix. Ensure the component matches the 28-lead TSSOP_EP outline dimensions for PCB footprint compatibility. Check for any recent product change notices that may affect pinout or specifications.
Select this component when designing ADSL/ADSL2+ CO line drivers requiring high output voltage swing and current drive. Consider the available power modes to optimize quiescent current consumption based on thermal constraints. Ensure the supply voltage range aligns with the system's power architecture between 10 V and 24 V. Evaluate thermal dissipation requirements given the potential for significant on-chip power loss during operation.
This part belongs to the AD8392A family of low-power, high-output current operational amplifiers designed specifically for xDSL applications. It integrates four amplifiers into a single package to reduce board space and simplify design. The device replaces discrete solutions by providing integrated common-mode generation and power control features essential for modern telecommunications infrastructure.
The AD8392AACPZ variants offer the same functionality in a 32-lead LFCSP package. Verify if the application requires the exposed pad connection or on-chip common-mode voltage generation features available in the AACP variant. Ensure thermal management strategies are adjusted if switching between TSSOP_EP and LFCSP packages due to different thermal resistance characteristics.