ADAQ23876BBCZ

Overview

The ADAQ23876BBCZ is a 16-bit, 15 MSPS µModule data acquisition solution from Analog Devices. It integrates a fully differential ADC driver, reference buffer, and SAR ADC in a 100-ball CSP_BGA package. The device supports pin-selectable input ranges (±10 V to ±1.5 V) with gain options from 0.37 to 2.25. Key electrical specifications include a typical SINAD of 90 dB at 1 kHz, THD of −121 dB, and INL error of ±9.2 ppm. It operates on a single 5 V supply with a typical power dissipation of 143 mW and features a serial LVDS interface.

Feature Summary

• Integrated signal chain combining FDA, reference buffer, and 16-bit SAR ADC
• Pin-selectable input ranges: ±10 V, ±5 V, ±4.096 V, ±2.5 V, and ±1.5 V
• Gain/attenuation options: 0.37, 0.73, 0.87, 1.38, and 2.25
• Serial LVDS digital interface with one-lane or two-lane output modes
• Low power consumption: 143 mW typical at 15 MSPS

Applications

• Automatic test equipment
• Data acquisition systems
• Hardware in the Loop (HiL)
• Power analyzers
• Medical imaging and instruments

Procurement Notes

Verify component authenticity through authorized Analog Devices distributors. Confirm package integrity for the 100-ball CSP_BGA format. Ensure ESD precautions are followed during handling due to sensitivity ratings. Check for specific revision markings matching Rev B documentation. Validate ordering suffixes against official manufacturer catalogs.

Selection Notes

Select based on required input voltage range and gain configuration. Choose between single-ended to differential or fully differential input topologies. Consider the serial LVDS interface mode (one-lane vs. two-lane) for data rate optimization. Evaluate thermal requirements given the 143 mW power dissipation in the small footprint package.

Part Context

This component belongs to the ADAQ2387x family of µModule data acquisition solutions. It utilizes system-in-package technology to reduce design burden by integrating critical passive components using iPassive technology. The device is designed to minimize temperature-dependent errors and optimize performance in high channel count multiplexed architectures.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.