RF Transceiver ICS ADF7023BCPZ product image

ADF7023BCPZ

$4.67
  • Description:IC RF TXRX+MCU ISM<1GHZ 32LFCSP
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:00611cec6c38 Category: Brand:

  
  • Quantity
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ADF7023BCPZ is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC RF TXRX+MCU ISM. Review the specifications below when checking this part for your BOM.

RF Transceiver ICS specifications for ADF7023BCPZ

  • Description:IC RF TXRX+MCU ISM<1GHZ 32LFCSP
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Type:TxRx + MCU
  • RF Family/Standard:General ISM < 1GHz
  • Protocol:-
  • Modulation:2FSK, GFSK, GMSK, MSK, OOK
  • Frequency:431MHz ~ 464MHz, 862MHz ~ 928MHz
  • Data Rate (Max):300kbps
  • Power - Output:13.5dBm
  • Sensitivity:-116dBm
  • Memory Size:4kB ROM, 2.5kB RAM
  • Serial Interfaces:SPI
  • Voltage - Supply:2.2V ~ 3.6V
  • Current - Receiving:12.8mA
  • Current - Transmitting:8.7mA ~ 32.1mA
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP (5x5)
  • GPIO:6
  • Grade:-
  • Qualification:-

RF Transceiver ICS datasheet and documents for ADF7023BCPZ

ADF7023BCPZ

RF Transceiver ICS Overview

The ADF7023BCPZ is a highly integrated RF transceiver from Analog Devices Inc., designed for sub-GHz ISM band applications. It operates within the frequency ranges of 431 MHz to 464 MHz and 862 MHz to 928 MHz. The device supports multiple modulation formats including 2FSK, GFSK, OOK, MSK, and GMSK. Key electrical specifications include a maximum data rate of 300 kb/s, a transmit output power of 13.5 dBm, and a receive sensitivity of -116 dBm. Power consumption is optimized with a receive current of 12.8 mA and a transmit current of 13.3 mA at a supply voltage range of 2.2 V to 3.6 V. The component is housed in a 32-lead LFCSP package.

RF Transceiver ICS Feature Summary

  • Integrates an on-chip 8-bit RISC processor to handle MAC layer functions, packet management, and radio control, reducing external microcontroller dependency.
  • Supports advanced error correction capabilities including Reed-Solomon coding and AES encryption for secure and reliable data transmission.
  • Features a low-power architecture suitable for battery-operated wireless telemetry and sensor network applications.

RF Transceiver ICS Applications

  • Smart metering systems
  • Wireless sensor networks
  • Home automation devices
  • IEEE 802.15.4g compliant applications

RF Transceiver ICS Procurement Notes

Verify the specific suffix and package variant when ordering, as availability may vary by region. Confirm that the selected part number matches the required frequency band and regulatory compliance standards for your target market. Ensure compatibility with the 32-LFCSP footprint during PCB layout. Check for moisture sensitivity levels and reflow soldering profile requirements prior to assembly.

RF Transceiver ICS Selection Notes

Select this component for designs requiring ultra-low power consumption combined with integrated baseband processing. The built-in MAC processor simplifies system architecture by offloading protocol tasks from the main CPU. Consider the supported modulation schemes and data rates against application latency requirements. Evaluate the operating temperature range and supply voltage constraints to ensure stability across the intended environmental conditions.

RF Transceiver ICS Part Context

This part belongs to the ADF7023 family of sub-GHz transceivers, which are engineered for high performance in license-free ISM bands. The series is characterized by its integration of RF front-end and digital baseband functions. It serves as a core connectivity solution for industrial, scientific, and medical (ISM) wireless applications requiring robust link margins and secure communication protocols.

RF Transceiver ICS Replacement Considerations

The ADF7023BCPZ-R7 is a reel-packaged version of the same functional device. Verify if tape-and-reel handling is preferred over tray packaging for automated assembly processes. No direct cross-model substitutes with different architectures are confirmed in public documentation.

ADF7023BCPZADF7023BCPZ
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