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ADG1233YRUZ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SPDTX3 190OHM 16TSSOP. Review the specifications below when checking this part for your BOM.
The ADG1233YRUZ is a monolithic iCMOS analog switch featuring three independently selectable single-pole, double-throw (SPDT) channels housed in a 16-lead TSSOP package. It operates on dual supplies ranging from ±5 V to ±16.5 V or a single supply of 5 V to 16.5 V. Key electrical parameters include a maximum on-resistance of 190 Ω at ±13.5 V and 475 Ω at 10.8 V single supply. The device exhibits 1.5 pF off capacitance, 0.5 pC charge injection, and a -3 dB bandwidth of 900 MHz under dual supply conditions. Digital inputs are compatible with 3 V logic, requiring a minimum high voltage of 2.0 V. Maximum operating temperature extends to +125°C for the Y version.
Verify the specific ordering suffix when purchasing. The REEL7 suffix indicates tape and reel packaging, whereas the absence of this suffix typically denotes tube packaging. Confirm that the Y version meets the required industrial temperature range of −40°C to +125°C for your application environment before finalizing orders.
Select the ADG1233YRUZ for applications requiring triple SPDT switching with low capacitance. Ensure the analog signal range stays within the supply rails. For single-supply designs, verify that the on-resistance flatness meets system requirements at the specific operating voltage. The 16-lead TSSOP package is suitable for surface-mount assembly with standard reflow profiles up to 260°C.
This component belongs to the ADG1233/ADG1234 family of low capacitance, triple/quad SPDT switches manufactured by Analog Devices. The ADG1233 variant specifically integrates three SPDT switches, while the ADG1234 includes four. Both utilize the same iCMOS process to support high voltage operation in compact footprints compared to conventional CMOS devices.
The ADG1233YCPZ-REEL7 serves as a functional replacement offering identical electrical specifications but utilizes a 16-lead LFCSP package instead of the TSSOP form factor. Designers must adjust PCB footprint layouts when substituting between these package options.
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